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Data Sheet
January 2002
DiskOnChip 2000 DIP
MD2200/2/3 Features
Single-chip plug-n-play flash disk Low power, single 3.3V or 5V power supply 16MB to 576MB capacity (1GB in 2002) Pinout and structure compatible with DiskOnChip Millennium DIP 8MB Simple, easy-to-integrate interface 32-pin DIP, JEDEC standard, EEPROM-compatible pinout 8KB sized memory window Boot OS capability Embedded TrueFFS software provides: -- Full hard disk read/write emulation
-- Third-generation wear leveling -- Automatic block management
Applications
Embedded systems
Operates with DiskOnChip SDK in OS-less environments, ANSI-C source code kit Error Detection and Correction (EDC/ECC) for higher data reliability Low power consumption - Static Operation Broad OS support: DOS, Windows NT4.0/5.0, Windows CE, BE, pSOS+, QNX, VxWorks, and others Compatible with major processors: x86, MediaGX, Geode SCxxxx, PowerPC, 68K, MIPS, SHx, StrongARM, and others
Internet access devices Internet set-top boxes/ITV, Web browsers WBT, thin clients, network computers Routers, networking Web phones, car PCs, DVD, HPC Point of sale, industrial PCs Telecom, medical
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Table of Contents
1 2 General Description................................................................................................................... 4 Detailed Feature List.................................................................................................................. 5
TrueFFS Technology............................................................................................................................ 5 Low Power Consumption ..................................................................................................................... 5 Temperature Range ............................................................................................................................. 5 Easy to Integrate .................................................................................................................................. 6 Robust Error Correction ....................................................................................................................... 6 High Reliability...................................................................................................................................... 6 High Speed........................................................................................................................................... 6 Compatibility with 8MB DiskOnChip Millennium Series ....................................................................... 6 Broad Support for Operating Systems and Processors ....................................................................... 6 Portable Solution - Shorter Time to Market ......................................................................................... 7 Complete Solution ................................................................................................................................ 7
3 4
Package Description and Pin List ............................................................................................ 8 Designing with the DiskOnChip 2000 Flash Disk ................................................................... 9 4.1 Hardware.............................................................................................................................. 9 4.2 Software ............................................................................................................................... 9 4.3 Designing DiskOnChip 2000 into PC Architecture ............................................................... 9
5
Disk Capacities and Contents ................................................................................................ 11 5.1 Low-Profile ......................................................................................................................... 11 5.2 High-Profile......................................................................................................................... 11 5.3 Media Contents .................................................................................................................. 11
6 7
Theory of Operation................................................................................................................. 12 6.1 Error Detection and Correction (EDC/ECC) ....................................................................... 12 Specifications .......................................................................................................................... 13 7.1 Absolute Maximum Ratings................................................................................................ 13 7.2 Capacitance ....................................................................................................................... 13 7.3 Temperature Ranges ......................................................................................................... 13 7.4 DiskOnChip Assembly........................................................................................................ 13 7.5 Humidity ............................................................................................................................. 13 7.6 EDC/ECC ........................................................................................................................... 13 7.7 DC Electrical Characteristics over Operating Range.......................................................... 14
7.7.1 Vcc = 5V Characteristics...........................................................................................................14 7.7.2 Vcc = 3.3V Characteristics........................................................................................................15
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7.8 AC Operating Conditions.................................................................................................... 15 7.9 Timing Specifications ......................................................................................................... 16
7.9.1 Read Cycle Timing....................................................................................................................16 7.9.2 Write Cycle Timing ....................................................................................................................17
8 9
Mechanical Dimensions .......................................................................................................... 18 Shock and Vibration ................................................................................................................ 19
10 Ordering Information ............................................................................................................... 19 11 Additional Information............................................................................................................. 20 How to Contact Us .......................................................................................................................... 21
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General Description
The DiskOnChip 2000 product line is the second-generation of M-Systems' DiskOnChip series of products. The 2000 series provides a small, single-chip, solid-state flash disk in a standard 32-pin DIP package. Combining a disk controller with flash memory on a single chip, DiskOnChip 2000 is the solution where minimal weight, space, and power consumption are essential. In consequence, the 2000 series finds use today in a wide range of products, such as information appliances, set-top boxes, thin clients, thin servers, network computers, and embedded, portable computers. By placing DiskOnChip 2000 in a standard socket, physical space requirements are reduced. Unlike standard IDE drives, no cables or extra space are required. DiskOnChip 2000 has no moving parts, resulting in significantly decreased power consumption and increased reliability. It is easy to use and reduces integration overhead. DiskOnChip 2000 is therefore a very attractive alternative to conventional hard and floppy disk drives. Using TrueFFS technology, DiskOnChip 2000 delivers full hard disk emulation. As such, the design and integration stages can be considerably reduced, thereby enabling very fast time-to-market and ease of production. Combined with its very attractive cost structure, DiskOnChip 2000 is a superior alternative to resident flash array (RFA). DiskOnChip 2000 products are available in capacities ranging from 16MB to 576MB. In addition, they are 100% pinout and software compatible with the DiskOnChip Millennium DIP 8MB package. In future versions, the capacity will be dramatically increased (up to 1GB during 2002). Since the same pinout will be retained, the socket on the target platform will not have to be changed to accommodate the larger capacities. DiskOnChip technology provides broad support for all major operating systems and processors in the market, enabling it to be readily integrated with any architecture. DiskOnChip 2000 is shipped as a plug-and-play device that is fully tested and formatted, and programmed with a DOS driver. Future driver, software or content upgrades, or formatting, can be made on-board or off-board using DiskOnChip utilities and accessories provided by M-Systems.
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Detailed Feature List
TrueFFS Technology
For a flash disk to emulate a hard disk, a software management layer is required. TrueFFS is M-Systems' patented flash file system management technology that allows flash components to fully emulate hard disks, so they can be written to and read from like any other hard disk. TrueFFS software simplifies and enhances flash memories by:
* Using third-generation wear leveling, which ensures that all blocks are erased an equal number of
times. This increases the life of the flash media by orders of magnitude.
* Using virtual blocking of the flash device to make erasure of large blocks transparent to the
operator.
* Automatic block mapping. * Implementing a robust power-loss recovery mechanism to guarantee absolute protection of data. * Providing conventional address support for various architecture configurations. * The TrueFFS driver supports 8-bit, 16-bit, and 32-bit bus architectures. Support for the 16-bit and
32-bit bus architectures, typically used in RISC processors, can be achieved by using the LSB of the data bus as follows: For 16-bit address boundary shifts, shift the address lines by one, so that the host address line A1 connects to DiskOnChip 2000 address line A0, the host address line A2 connects to DiskOnChip 2000 line A1, and so on. For 32-bit address boundary shifts, shift the address lines by two, so that the host address line A2 connects to DiskOnChip 2000 address line A0, the host address line A3 connects to DiskOnChip 2000 line A1, and so on. Refer to Application Note AP-DOC-030 for more details.
Low Power Consumption
The internal functions are synchronized with the CPU's read and write strobes. This innovation eliminates the need for an external clock and dramatically reduces power consumption. DiskOnChip 2000 requires only a single 3.3V or 5V power supply, which helps simplify integration. These features make DiskOnChip 2000 the best cost/performance solution for computers that require minimal weight, space, and power consumption, providing a very attractive alternative to conventional hard and floppy disk drives.
Temperature Range
DiskOnChip 2000 is available in both commercial (0 C to +70 C) and extended (-40 C to +85 C) temperature ranges.
* DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
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Easy to Integrate
Fast integration is ensured by the following DiskOnChip 2000 features:
* Compatibility with standard EEPROM DIP pinout * Support for local bus and ISA bus interface * Small memory map window size - only 8KB * Static operation - no clock required * 16mA output drive (18mA at 3.3V)
Robust Error Correction
The DiskOnChip family utilizes a Reed-Solomon Error Detection Code (EDC) and Error Correction Code (ECC), providing the following error immunity for each 512-byte block of data:
* Corrects up to two 10-bit symbols, including two random bit errors * Corrects single bursts of up to 11 bits * Detects single bursts of up to 31 bits, and double bursts of up to 11 bits * Detects up to 4 random bit errors
High Reliability
DiskOnChip 2000 can be inserted into standard DIP sockets, eliminating the need for mechanical disk drives, bulky ribbon cables and connectors. The design of DiskOnChip 2000 ensures high reliability even when subjected to levels of shock, vibration, and temperature changes that would destroy a conventional magnetic disk drive.
High Speed
DiskOnChip 2000 implements an integrated architecture for data transfers, which eliminates bottlenecks typical in this area. Additionally, it doubles read performance and significantly improves write performance, in comparison to competitive alternatives. DiskOnChip 2000 can sustain system write speeds of over 550KB per second, read speeds of more than 1.4MB per second (measured in ISA no wait state environment) and read/write burst transfer rates of nearly 5MB per second.
Compatibility with 8MB DiskOnChip Millennium Series
DiskOnChip 2000 is a 32-pin Dual Inline Package (DIP) that provides 100% pinout compatibility with M-Systems' DiskOnChip Millennium DIP (8MB). DiskOnChip 2000 is fully software compatible with M-Systems' DiskOnChip Millennium DIP (8MB), for version 1.21 and higher.
Broad Support for Operating Systems and Processors
The DiskOnChip family of products, supplied with TrueFFS firmware, supports a wide range of operating systems (OS), including DOS, Windows 2000, Windows CE, Windows NT, Windows Embedded NT, BE, QNX, VxWorks, pSOS, Linux, FreeBSD, PharLap ETS, VRTX and more.
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In addition, leading operating systems such as Windows CE and Tornado, offer native support for the DiskOnChip family of products for easy integration. For OS-less applications and customized solutions, M-Systems offers its DiskOnChip TrueFFS SDK, an ANSI-C source code kit designed specifically to support these environments. The DiskOnChip family of products is compatible with all major processors, supporting popular processors such as x86, 68K, MediaGx, Geode SCxxxx, PowerPC, MIPS, SHx, StrongARM, and many others.
Portable Solution - Shorter Time to Market
The development and integration time for implementing a flash disk is greatly reduced by DiskOnChip's standard software interface, which provides portability to other operating systems and processors and thereby shortens your time to market.
Complete Solution
The DiskOnChip 2000 series offers a full flash disk solution that includes different voltage and temperature options, software drivers tailored to your operating system, data sheets, application support and online email support. Using DiskOnChip evaluation boards (EVB), you can develop your software before the target hardware is ready. The DiskOnChip GANG Programmer reduces your production time, and facilitates fast response time to application software changes during production stages. In all, DiskOnChip offers a complete set of tools for delivering a complete solution whenever your application can use a flash disk.
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Package Description and Pin List
#
X
# #
Figure 1: Package Description and Pinout Pin Name A0 - A12 D0 - D7 CE# OE# WE# NC Description Address bus Data bus Chip Enable, active low Output Enable, active low Write Enable, active low Not Connected. These pins may be left floating, tied to Vcc, GND or logic levels. Absolute Maximum Ratings must be observed. Power Ground Pin Number 4 to 12, 23, 25 to 27 13 to 15, 17 to 21 22 24 31 1, 2, 3, 28, 29, 30 Direction Input I/O Input Input Input
VCC GND
32 16
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4.1
Designing with the DiskOnChip 2000 Flash Disk
Hardware
DiskOnChip 2000 should be connected as a standard memory device, using standard memory interface signals. Typically, DiskOnChip 2000 can be mapped to any free 8KB memory space. In PC architectures, if the memory window allocated to DiskOnChip 2000 is larger than 8KB, an automatic anti-aliasing mechanism prevents the firmware from being loaded more than once. Figure 1 illustrates a typical interface between DiskOnChip 2000 and a system.
A[12:0] D[7:0] OE# WE# CE#
DiskOnChip 2000 Any Capacity
Figure 2: Simplified I/O Diagram
4.2
Software
DiskOnChip 2000, under control of TrueFFS, is accessed using standard file system calls like any other block device. Applications can write to and read from any sector on DiskOnChip 2000, which is compatible with all diagnostic utilities, applications and file systems. The flash memory within DiskOnChip 2000 is accessed by TrueFFS through an 8KB window in the CPU's memory space. TrueFFS handles the paging of this window in the flash array, as well as providing flash disk emulation that includes flash table management, wear leveling, mapping out bad blocks, and background space reclamation of unused flash blocks. The same 8KB address space will be retained in future versions of DiskOnChip 2000 that offer greater capacities.
4.3
Designing DiskOnChip 2000 into PC Architecture
When used in PC-compatible architectures, DiskOnChip 2000 is allocated an 8KB memory window in the BIOS expansion memory range, which is usually located between 0C8000h and 0EFFFFh. Figure 3 illustrates the DiskOnChip 2000 memory window in relation to the PC memory map.
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Extended Memory
0FFFFFh 0F0000h
BIOS DiskOnChip
1MB
8KB
0C8000h 0A0000h
Display
640KB
RAM
0
Figure 3: PC Memory Map
After reset, the BIOS executes the POST (Power On Self-Test), and then searches for all expansion ROM devices. When DiskOnChip 2000 is found, the BIOS executes the Initial Program Loader (IPL) code located in the boot-block area of DiskOnChip 2000. This code loads the TrueFFS driver into system memory, installs DiskOnChip 2000 as a disk in the system, and then returns control back to the BIOS code. The operating system subsequently attempts to identify disks that are available and the DiskOnChip 2000 software (TrueFFS) responds by emulating a hard disk. From this point onward, DiskOnChip 2000 is identified by the system as a standard disk drive. It is assigned a drive letter and it can be used by any software application. No BIOS setup modifications, autoexec.bat/config.sys modifications or external software are required.
* DiskOnChip 2000 can be used as the only disk in the system, in which case it will be accessed as
drive [C:].
* DiskOnChip 2000 can operate with or without a floppy drive, or with additional hard disks. When
working with a hard disk, DiskOnChip 2000 can be configured as the last drive (the default configuration). In this case, the hard disk will be drive [C:] and DiskOnChip 2000 will be drive [D:].
* DiskOnChip 2000 can also be configured as the first drive. In this case, the hard disk will be drive
[D:] and DiskOnChip 2000 will be drive [C:].
* DiskOnChip 2000 can be used as the boot device when configured as drive [C:]. In this
configuration, you must format DiskOnChip 2000 as a bootable device by copying the OS files onto the disk. When running DOS, use the SYS command for this purpose.
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5.1
Disk Capacities and Contents
Low-Profile
Formatted Capacity (bytes)
16,375,808 24,592,384 32,800,768 49,233,920 65,683,456 98,566,144 197,279,744
The capacities for the various models are detailed in the following two tables.
Model
Sectors
Formatted Capacity under DOS 6.22 (bytes)
16,324,608 24,516,608 32,724,992 49,092,608 65,525,760 98,390,016 103,829,024
Sectors under DOS 6.22
31,884 47,884 63,916 95,884 127,980 192,168 385,280
MD2202-D16 MD2200-D24 MD2202-D32 MD2202-D48 MD2202-D64 MD2202-D96 MD2202-D192
31,984 48,032 64,064 96,160 128,288 192,512 381,300
5.2
High-Profile
Formatted Capacity (bytes)
82,116,608 114,999,296 147,881,984 164,331,520 197,214,208 230, 031, 360 262, 930, 432 295, 796, 736 591, 790, 080
Model
Sectors
Formatted Capacity under DOS 6.22 (bytes)
81, 989, 632 114, 786, 304 147, 578, 880 164, 151, 296 196, 980, 736 229, 584, 896 262, 647, 808 295, 624, 704 311, 427, 072
Sectors under DOS 6.22
160,136 224,192 288,240 320,608 384,728 448, 408 512, 984 577,392 1,155,776
MD2203-D80 MD2203-D112 MD2203-D144 MD2203-D160 MD2203-D192 MD2203-D224 MD2203-D256 MD2203-D288 MD2203-D576
160,384 224,608 288,832 320,960 385,184 449, 280 513, 536 577,728 1,142,970
5.3
Media Contents
DiskOnChip 2000 products are shipped from M-Systems fully tested, already formatted, and come with a DOS driver.
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Theory of Operation
VCC GND CE# WE# OE# D[0:7] A[0:12]
System Interface
Flash Control
Flash
Boot Block (IPL ROM)
EDC/ECC
Figure 4: DiskOnChip 2000 Simplified Block Diagram
DiskOnChip 2000 appears to the system's hardware as a standard EEPROM, via the System Interface block. The host cycles are passed to the Flash Control block, to be written to or read from the flash device. To ensure the highest level of reliability, each cycle is monitored by the EDC/ECC (Error Detection and Correction) block. In write cycles, the EDC/ECC block generates a syndrome for every sector that contains data, which is stored in the flash together with the sector. When the sector is read, the syndrome is regenerated for the data and compared with the original syndrome. When a mismatch is detected, it is repaired. The boot block is responsible for answering the BIOS expansion search in PC architectures. After the BIOS identifies DiskOnChip 2000 as a valid BIOS expansion device, it executes the code stored in the boot block. The BIOS then loads the TrueFFS software from the flash memory into the host memory, delivering full disk capabilities to the operating system. This code is identical for all DiskOnChip 2000 capacities, since TrueFFS automatically detects the memory capacity of DiskOnChip 2000.
6.1
Error Detection and Correction (EDC/ECC)
DiskOnChip 2000 uses the Reed-Solomon EDC/ECC algorithm to ensure high data reliability. Each time a block of data is written to the flash, a 6-byte checksum is also written. Each time the data is read back from the flash, a new 6-byte code is computed. TrueFFS uses these checksums for error detection and, if necessary, error correction.
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7.1
Specifications
Absolute Maximum Ratings
Symbol
VCCS VIN IIN
Parameter
DC supply voltage Input pin voltage2 Input pin current
3.3V Model Rating1
-0.5 to 4.6 -0.5 to VCC + 0.3 Not Specified
5V Model Rating1
-0.3 to 6.0 -0.3 to VCC + 0.3 -10 to 10
Units
V V mA
Notes
+25 C
Note 1: Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2: The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20ns.
7.2
CI/O
Capacitance
Parameter
Input/Output Capacitance
Symbol
Conditions
MD2200/2, VIN = 0V MD2203, VIN = 0V
3.3V Model Rating
12 36
5V Model Rating
15 45
Unit
pF pF
Note: Capacitance is not 100% tested.
7.3
Temperature Ranges
0 C to +70 C* -40 C to +85 C -50 C to +85 C
Commercial operating temperature: Extended operating temperature: Storage temperature:
*DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.
7.4
DiskOnChip Assembly
The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device failures not covered by M-Systems' warranty.
Note: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it cannot be soldered directly to the platform.
7.5
Humidity
10% - 90% relative, non-condensing
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7.6
EDC/ECC
Enhanced Reed-Solomon:
* Corrects up to two 10-bit symbols, including two random bit errors. * Corrects single bursts of up to 11 bits. * Detects single bursts of up to 31 bits and double bursts of up to 11 bits. * Detects up to 4 random bit errors.
7.7 7.7.1
Symbol VCCS VIH VIL VOH VOL IIL
DC Electrical Characteristics over Operating Range Vcc = 5V Characteristics
Parameter System Supply Voltage High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage Input Leakage Current IOH = -16mA IOL = 16mA MD2200, MD2202 MD2203 2.4 0.4 Conditions Min 4.5 2.0 0.8 Typ 5.0 Max 5.5 Unit V V V V V A A A A mA A A
10 30 10 30
40 60 240 60 400 1200
IOZ
Output Leakage Current
MD2200, MD2202 MD2203
IVCC ISTDBY
Supply Current Standby Current
200ns Cycle Time, Outputs open MD2200, MD2202 MD2203
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7.7.2
Symbol VCCS VIH VIL VHYS VOH VOL IIL IOZ IVCC ISTDBY
Vcc = 3.3V Characteristics
Parameter System Supply Voltage High-level Input Voltage Low-level Input Voltage Input Voltage Hysteresis High-level Output Voltage Low-level Output Voltage Input Leakage Current Output Leakage Current Supply Current Standby Current Conditions Min 3.0 2.7 1.1 IOH = -18mA IOH = 0mA IOL = 18mA IOL = 0mA MD2200, MD2202 MD2203 MD2200, MD2202 MD2203 150ns Cycle Time, Outputs open MD2200, MD2202 MD2203 30 70 300 2.4 Vcc-0.1 0.4 0.1 Typ 3.3 Max 3.6 0.6 1.5 Unit V V V V V V V V A A A A mA A A
10 30 10 30
60 400 1350
7.8
AC Operating Conditions
Timing specifications are based on the following conditions:
Parameter Supply Voltage Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels Output Load 3.3V Model VCC = 3.3V 0.3V 0.2V to 2.9V 1ns 1.5V 100 pF 5V Model VCC = 5V 0.5V 0.4V to 2.6V 5ns 0.8V and 2.0V 50 pF
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7.9 7.9.1
Timing Specifications Read Cycle Timing
TSU(A)
A[0..12]
CE#
THO(CE1) TSU(CE0) THO(CE0) TACC TSU(CE1)
OE#
TREC
WE#
TEN(D) TDIS(D)
D[0..7]
Figure 5: Read Cycle
Symbol TSU(A) THO(A) TSU(CE0) THO(CE0) THO(CE1) TSU(CE1) TREC TACC TEN(D) TDIS(D) Description Address to OE# OE# CE# OE# setup 2 35 0 0 8 8 20 110 15 75 13 7 3.3V Min (ns) Max (ns) Min (ns) 10 56 0 0 42 42 59 130 91 44 1 2 5V Max (ns) Notes
to Address hold to OE# setup
to CE# = 0 hold to CE# = 1 hold setup time
OE# or WE# CE# OE# OE# OE#
to WE# or OE#
to start of next cycle to D active delay to D Hi-Z delay
Read access time
Note 1: CE# may be asserted any time before or after OE# is asserted. If CE# is asserted after OE#, all timing relative to OE# asserted will be referenced instead to the time CE# was asserted. Note 2: CE# may be negated any time before or after OE# is negated. If CE# is negated before OE#, all timing relative to OE# negated will be referenced instead to the time CE# was negated.
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7.9.2
Write Cycle Timing
TSU(A) THO(A)
A[0..12]
THO(CE1)
CE#
THO(CE0)
THO(CE0) TW (WE)
TSU(CE1) TREC
OE#
WE#
TSU(D) THO(D)
D[0..7]
Figure 6: Write Cycle
Symbol
TSU(A) THO(A) TW(WE) TSU(CE0) THO(CE0) THO(CE1) TSU(CE1) TREC TSU(D) THO(D)
Description
Address to WE# WE# CE# WE# setup time 0 35 62 0 0 8 8 22 50 0
3.3V Min (ns) Max (ns) Min (ns)
10 56 98 0 0 42 42 59 48 40
5V Max (ns)
Notes
to Address hold time to WE# setup time
WE# asserted width
1 2
to CE# = 0 hold time to CE# = 1 hold time setup time
OE# or WE# CE# WE#
to WE# or OE#
to start of next cycle setup time
D to WE# WE#
to D hold time
Note 1: CE# may be asserted any time before or after WE# is asserted. If CE# is asserted after WE#, all timing relative to WE# asserted will be referenced instead to the time CE# was asserted. Note 2: CE# may be negated any time before or after WE# is negated. If CE# is negated before WE#, all timing relative to WE# negated will be referenced instead to the time CE# was negated.
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Mechanical Dimensions
Figure 7: MD220x Mechanical Dimensions Low-Profile MD2200 Millimeters (max.) A B C D E F G H High-Profile MD2203 Millimeters (max.) A B C D E F G H 45.6 18.8 2.54 15.24 13.5 4.0 0.51 38.2 41.9 18.05 2.54 15.24 5.7 4.0 0.51 38.2 MD2202 Millimeters (max.) 43.95 18.3 2.54 15.24 6.0 4.0 0.51 38.2
Note: The above dimensions are maximum values.
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Shock and Vibration
Test Conditions
100Hz~2000Hz, 15G peak, 3 cycles per axis (1hr.), 3 axes Half sine shock 50G, 11msec, +/-3 shock per axis, 3 axes
Reliability Test
Vibration Mechanical Shock
Reference Standard
STD-202F, Method 204D STD-202F, Method 213B
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Ordering Information
CC: V: T: Capacity (MB) Supply Voltage Temperature Range (optional) 24 Blank V3 Blank X 5V 3.3V Commercial: 0 C to +70 C Extended: -40 C to +85 C
MD2200-DCC-V-T (Low-Profile)
MD2202-DCCC-V-T (Low-Profile) CC: V: T: Capacity (MB) Supply Voltage Temperature Range (optional) 16, 32, 48, 64, 96, 192* Blank V3 Blank X 5V 3.3V Commercial: 0 C to +70 C Extended: -40 C to +85 C
MD2203-DCCC-V-T (High-Profile) CCC: V: T: Capacity (MB) Supply Voltage Temperature Range (optional) 80, 112, 144, 160, 192, 224, 256, 288, 576* Blank V3 Blank X 5V 3.3V Commercial: 0 C to +70 C Extended: -40 C to +85 C
* DiskOnChip 2000 DIP 192MB and 576MB capacities are available only for commercial temperature ranges.
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Additional Information
Description DiskOnChip Utilities User Manual DiskOnChip Quick Installation Guide Application Note: Designing with DiskOnChip DIP Application Note: Using DiskOnChip with QNX Application Note: DiskOnChip Boot Developers Kit Application Note: Designing DiskOnChip Millennium in RISC Environment Application Note: Designing with DiskOnChip Millennium in a PC Environment Application Note: Onboard Programming of the DiskOnChip Millennium Application Note: Designing DiskOnChip as a Flash Disk & Boot Device Replacement Installation Manual: Using DiskOnChip with Windows CE Installation Manual: Using DiskOnChip with Linux O/S Installation Manual: Using DiskOnChip with VxWorks DiskOnChip TrueFFS SDK Product Brief DiskOnChip DIP Evaluation Board DiskOnChip 1+8 DIP GANG Programmer
Document/Tool DiskOnChip Utilities DiskOnChip Quick Installation Guide AP-DOC-010 AP-DOC-016 AP-DOC-020 AP-DOC-030 AP-DOC-031 AP-DOC-039 AP-DOC-047 IM-DOC-017 IM-DOC-021 IM-DOC-022 DiskOnChip TrueFFS SDK Product Brief DiskOnChip DIP EVB DiskOnChip GANG Programmer
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DiskOnChip 2000 DIP
How to Contact Us
Internet: E-mail: USA Office: M-Systems Inc. 8371 Central Ave, Suite A Newark CA 94560 Phone: +1-510-494-2090 Fax: +1-510-494-5545 Taiwan Office: Room B, 13 F, No. 133 Sec. 3 Min Sheng East Road Taipei, Taiwan R.O.C. Tel: +886-2-8770-6226 Fax: +886-2-8770-6295 Japan Office: M-Systems Japan Inc. Arakyu Bldg., 5F 2-19-2 Nishi-Gotanda Shinagawa-ku Tokyo 141-0031 Phone: +81-3-5437-5739 Fax: +81-3-5437-5759 M-Systems assumes no responsibility for the use of the material described in this document. Information contained herein supersedes previously published specifications on this device from M-Systems. M-Systems reserves the right to change this document without notice. http://www.m-sys.com info@m-sys.com China Office: 25A International Business Commercial Bldg. Nanhu Rd., Lou Hu District Shenzhen, China 518001 Phone: +86-755-519-4732 Fax: +86-755-519-4729 Europe and Israel Office: M-Systems Ltd. 7 Atir Yeda St. Kfar Saba 44425, Israel Tel: +972-9-764-5000 Fax: +972-3-548-8666
91-SR-002-42-8L Rev. 3.4
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Price & Availability of MD2200

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